A4 Diamond Lapping Film Wet/Dry Sandpaper for Tungsten Carbide, Silicon Carbide, Optical Fiber, Jade Polishing
$2.78
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Diamond abrasive particles provide superior hardness and cutting efficiency for various materials.
Versatile wet and dry application suitable for a wide range of polishing and grinding tasks.
A4 size (220x280mm) offers ample surface area for efficient manual or machine polishing.
Ideal for precision polishing of optical fiber connectors, jade, tungsten carbide, and silicon carbide.
Durable construction ensures long-lasting performance and consistent abrasive quality.